Lead Free Solder Wire Sn96.5Ag3.0Cu0.5, also known as SAC305, represents a remarkable innovation in the realm of soldering. Comprised of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu), this solder wire embodies the evolution of soldering towards environmentally conscious solutions. It's a premium quality solder alloy that is suitable for soldering tasks of high precision and high-quality requirements. Adding the silver is to enhance the electrical conductivity and resistance of corrosion. While adding copper is to improve the resistance to thermal fatigue and to improve the wetting property. |
Alloy Composition | 96.5% Tin (Sn), 3.0% Silver (Ag), 0.5% Copper (Cu) |
Melting Point | 217-220°C |
Flux Core Type | Rosin based flux or solid wire without flux |
Flux Content | 2% or customized as required |
Weight | 100g/roll, 200g/roll, 500g/roll, 1kg/roll or as required |
Wire Diameter | From 0.3mm to 3.2mm |
Brand | XF Solder or OEM service |
Rosin Flux Core | Different Wire Diameters | Different Roll Sizes |
Super Conductivity The inclusion of 3% silver adds superior electrical conductivity to the solder, making it apt for applications requiring efficient current flow. | Excellent Wetting The presence of copper enhances the wetting proper, ensuring the solder will be evenly distributed and form strong connections. | |
Reliable Performance This solder wire is high quality material, it has good thermal conductivity and the solder joints are strong. It has long service life on the soldered components. | RoHS Compliance SAC305 Solder wire is lead free alloy, it doesn't contain lead. It's ideal to be used for applications that requires RoHS or REACH compliant. |
For soldering electronic components and electrical devices such as printed circuit boards, sensors, connectors, switches, microwave ovens, air conditioners, electric kettles, hair dryers and other components.
Soldering medical equipment such as pacemakers, defibrillators, ultrasound machines, and other devices that need to avoid lead contamination and comply with RoHS regulations.
Manual Soldering | Automatic Soldering | Jewelry Soldering |
Manual Soldering: Lead Free Solder Wire Sn96.5Ag3.0Cu0.5 is versatile for manual soldering using soldering irons or stations.
Automatic Soldering: For mass production of electronics devices or PCBs, robot automatic soldering is accurate and fast.
Lead Free Solder Wire Sn96.5Ag3.0Cu0.5, also known as SAC305, represents a remarkable innovation in the realm of soldering. Comprised of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu), this solder wire embodies the evolution of soldering towards environmentally conscious solutions. It's a premium quality solder alloy that is suitable for soldering tasks of high precision and high-quality requirements. Adding the silver is to enhance the electrical conductivity and resistance of corrosion. While adding copper is to improve the resistance to thermal fatigue and to improve the wetting property. |
Alloy Composition | 96.5% Tin (Sn), 3.0% Silver (Ag), 0.5% Copper (Cu) |
Melting Point | 217-220°C |
Flux Core Type | Rosin based flux or solid wire without flux |
Flux Content | 2% or customized as required |
Weight | 100g/roll, 200g/roll, 500g/roll, 1kg/roll or as required |
Wire Diameter | From 0.3mm to 3.2mm |
Brand | XF Solder or OEM service |
Rosin Flux Core | Different Wire Diameters | Different Roll Sizes |
Super Conductivity The inclusion of 3% silver adds superior electrical conductivity to the solder, making it apt for applications requiring efficient current flow. | Excellent Wetting The presence of copper enhances the wetting proper, ensuring the solder will be evenly distributed and form strong connections. | |
Reliable Performance This solder wire is high quality material, it has good thermal conductivity and the solder joints are strong. It has long service life on the soldered components. | RoHS Compliance SAC305 Solder wire is lead free alloy, it doesn't contain lead. It's ideal to be used for applications that requires RoHS or REACH compliant. |
For soldering electronic components and electrical devices such as printed circuit boards, sensors, connectors, switches, microwave ovens, air conditioners, electric kettles, hair dryers and other components.
Soldering medical equipment such as pacemakers, defibrillators, ultrasound machines, and other devices that need to avoid lead contamination and comply with RoHS regulations.
Manual Soldering | Automatic Soldering | Jewelry Soldering |
Manual Soldering: Lead Free Solder Wire Sn96.5Ag3.0Cu0.5 is versatile for manual soldering using soldering irons or stations.
Automatic Soldering: For mass production of electronics devices or PCBs, robot automatic soldering is accurate and fast.
We are a professional manufacturer of 1mm 2mm 60 40 Soldering Wire Resin Cored 450grm 1kg 250g 500 gm for Online Shop Sell from China. It's the art of crafting durable, precise, and reliable connections. Introducing our 60/40 resin-cored solder wire, designed to elevate your soldering experience with a fusion of performance, convenience, and versatility. Whether you're a seasoned professional or a passionate hobbyist, this solder wire is your go-to solution for flawless results.
Our 50/50 Tin-Lead Solder Paste offers a perfect balance of performance and reliability for SMD assembly. Whether you're looking for superior wettability, strong joint formation, or dependable conductivity, this product is your trusted partner in achieving top-tier results in electronics manufacturing.
Sn40/Pb60 soldering lead, composed of 40% tin and 60% lead. Offered in versatile diameters of 1mm and 2mm, and conveniently packaged in 250g reels, this alloy is a reliable solution for various electronics soldering applications. Its balance of cost-efficiency, reliability, and versatility makes it an excellent choice for a variety of soldering applications.
We are a manufacturer of Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) for Surface Mount of Printed Circuit Boards from China. The tin content (96.5%) provides excellent melting characteristics, while the 3% silver enhances mechanical strength and solder joint reliability. Copper (0.5%) further stabilizes the alloy and contributes to improved thermal and mechanical properties, ensuring that it meets the demands of printed circuit board assembly by surface mount.