Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) for Surface Mount of Printed Circuit Boards from China 

Lead-free solder paste, specifically with a composition of 96.5% tin, 3% silver, and 0.5% copper (SAC305), is widely used in surface-mount technology (SMT) for printed circuit boards (PCBs). As a high-performance alternative to traditional leaded solder, this solder paste Sn96.5/Ag3/Cu0.5 meets stringent environmental standards, is RoHS compliant, and is a top choice for industries prioritizing eco-friendly manufacturing without sacrificing performance or reliability.

Product Overview of Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) for Surface Mount of Printed Circuit Boards

This lead-free solder paste is formulated from a carefully controlled mixture of finely powdered SAC305 alloy suspended in flux. The tin content (96.5%) provides excellent melting characteristics, while the 3% silver enhances mechanical strength and solder joint reliability. Copper (0.5%) further stabilizes the alloy and contributes to improved thermal and mechanical properties, ensuring that it meets the demands of modern electronic assembly.

Advantages of Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper)

Environmentally Friendly: With a lead-free formulation, solder paste Sn96.5/Ag3/Cu0.5 complies with RoHS (Restriction of Hazardous Substances) regulations, making it a safer choice for workers and the environment, especially critical in electronics manufacturing.

High Mechanical Strength: The presence of 3% silver in the solder paste significantly increases the solder joints' durability. This is essential for applications that require robust mechanical connections, such as automotive and industrial electronics.

Reliable Solder Joints: Solder paste (96.5% Tin, 3% Silver, 0.5% Copper) ensures excellent wetting and adhesion on various PCB surfaces. The soldered connections are resistant to thermal cycling, which enhances the lifespan and reliability of electronic devices, especially in high-stress applications.

Good Electrical Conductivity: This solder paste 96.5% tin ensures low electrical resistance, making it ideal for electronic circuits where efficient conductivity is essential for performance.

Wide Process Window: Alloy Sn96.5/Ag3/Cu0.5 has a melting range of 217-221°C, suitable for the controlled reflow process in surface mount printing (SMT). It allows manufacturers to fine-tune the reflow profile for optimal results and minimized defects, even with complex or densely packed boards.

How to Use Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) for Surface Mount of Printed Circuit Boards

Storage and Preparation: Lead-free solder paste 3% silver should be stored at a low temperature (ideally 0-10°C) to maintain its shelf life and prevent the paste from drying out or separating. Before use, bring the paste to room temperature to avoid condensation on the board surface.

Application: Apply the solder paste Sn96.5/Ag3/Cu0.5 precisely to PCB pads using a stencil and squeegee to ensure consistent paste thickness. The paste deposition quality is critical to forming strong and reliable joints, so maintaining clean stencils and optimal printing parameters is essential.

Component Placement: Place the components accurately on the solder paste applied pads. Modern pick-and-place machines ensure precise component alignment with the paste, which helps in creating reliable connections.

Reflow Process: The reflow soldering profile for solder paste (96.5% Tin, 3% Silver, 0.5% Copper) typically includes preheat, soak, reflow, and cooling stages. The peak reflow temperature should be between 230-250°C to fully melt the paste without damaging components.

Inspection and Testing: After reflow, inspect the solder joints using automated optical inspection (AOI) systems or X-ray if available, to ensure proper joint formation, especially in fine-pitch and BGA components.

Conclusion 

The Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) provides a reliable, eco-friendly solution for high-performance electronics assembly. It balances environmental responsibility with excellent mechanical and thermal characteristics, making it ideal for use in SMT applications across a wide range of industries, including consumer electronics, automotive, and industrial sectors. By following best practices in storage, application, and reflow, manufacturers can achieve durable and consistent results with this advanced soldering material.

If you are looking for a manufacturer of Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) for Surface Mount from China, please contact us.

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