Solder Paste 50% Tin 50% Lead Sn50Pb50 for SMD Applications from China 

Our high-quality Solder Paste 50% Tin 50% Lead is engineered for superior performance in surface mount device (SMD) applications. This solder paste Sn50Pb50 combines a balanced tin-to-lead ratio, ensuring consistent results in electronic assembly processes. Designed for reliability and efficiency, it meets the rigorous demands of modern manufacturing.

Key Features of Solder Paste 50% Tin 50% Lead Sn50Pb50 for SMD Applications

Nice Composition: The 50/50 tin-to-lead ratio provides a melting point of approximately 183–215°C, offering excellent wetting properties and smooth solder joints.

High Adhesion: Solder paste 50/50 ensures strong bonding between components and printed circuit boards (PCBs), reducing the risk of failures.

Consistent Printability: Fine, uniform paste texture enables precise stencil printing and minimizes defects such as slumping or bridging.

Long Stencil Life: Solder paste Sn50Pb50 retains its properties over extended production runs, reducing the need for frequent cleaning or paste replacement.

Reliable Electrical Conductivity: Delivers low resistance connections critical for high-performance electronics.

Affordable Cost: The solder paste with 50% lead and 50% tin is at much lower material cost, when comparing to other alloys of 63/37 or lead free solder paste.

Applications of Solder Paste 50% Tin 50% Lead Sn50Pb50 for SMD

This solder paste 50% tin 50% lead is ideal for a wide range of SMD applications, including:

Consumer electronics

Telecommunication equipment

Automotive electronics

Medical devices

Industrial control systems

Technical Specifications

Composition of Solder Paste: 50% Tin (Sn), 50% Lead (Pb)

Flux Type: Rosin-based (activated or non-activated options available)

Melting Range: 183–215°C

Viscosity: Optimized for stencil and screen printing

Packaging Options: Available in jars of 500g, syringes, or cartridges of 100g 200g 50g etc, to meet diverse production needs

Storage and Handling of Solder Paste 50% Tin 50% Lead Sn50Pb50 for SMD Applications

Store between 0–10°C in a sealed container to maintain performance.

Allow the paste to reach room temperature before opening to avoid condensation.

Use within the recommended shelf life for optimal results.

Compliance and Safety for Solder Paste 50% Tin 50% Lead Sn50Pb50 for SMD Applications

This product is manufactured to meet industry standards, but due to its lead content, it is not RoHS compliant. Proper handling and disposal practices must be followed in accordance with local regulations.

Conclusion

Our 50/50 Tin-Lead Solder Paste offers a perfect balance of performance and reliability for SMD assembly. Whether you're looking for superior wettability, strong joint formation, or dependable conductivity, this product is your trusted partner in achieving top-tier results in electronics manufacturing.

If you are looking for of Solder Paste 50% Tin 50% Lead Sn50Pb50 for SMD Applications from China, for inquiries or to place an order, contact our sales team today.

Contact Information:

Email: xfsolder@gmail.com or xfsolder@163.com

WhatsApp/Wechat: 008613450770997