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 | Lead Free Solder Paste Sn42Bi58, composed of 42% tin (Sn) and 58% bismuth (Bi), is a groundbreaking soldering material that stands out for its low melting point and lead-free composition. This low temperature solder paste is designed to provide efficient and reliable soldering, particularly for applications that involve heat-sensitive components.
Tin Bismuth Solder Paste Sn42Bi58 is meticulously crafted by combining carefully selected solder alloy particles, flux, and binders. The alloy's composition, primarily comprising tin and bismuth, delivers a soldering solution with a significantly lower melting point compared to conventional solder materials. |
Alloy Composition | 42% Tin (Sn), 58% Bismuth (Bi) |
Melting Point | 138°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce this solder paste in syringe | |
Syringe of Solder Paste |
Jar of Solder Paste |
Low Melting Point It has remarkably low melting point, making it ideal for soldering components prone to heat damage, reducing the risk of component failure. | Excellent Soldering Effect This low temperature solder paste can produce round, bright and firm solder joints, this provides long life span to the electronic products. | |
Reasonable Cost Comparing to other lead free solder paste, this solder paste doesn't contain silver, the price is much cheaper. | Lead Free Compliance This solder paste Sn42Bi58 is not consisted of lead, making it suitable for manufacturing that requires RoHS lead free compliant. |
Electronics and devices with Heat-Sensitive Components: Sn42Bi58 solder paste is a staple in electronics manufacturing, particularly for devices with components vulnerable to high temperatures.
Solder Paste Jet Printing |
Solder Paste Manual Printing |
Solder Paste Hand Soldering |
Printing: Use stencil to lay on the PCB and make sure that the opening holes of the stencil precisely sit on the solder pads. And print the low temperature solder paste onto the PCB.
Installing SMD Components: Carefully put surface mount components onto the solder paste-covered pads.
Soldering: Use reflow ovens or hot hair guns to heat the assembled PCB to melt the solder paste to solidify the solder joints.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the tin bismuth solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
| Lead Free Solder Paste Sn42Bi58, composed of 42% tin (Sn) and 58% bismuth (Bi), is a groundbreaking soldering material that stands out for its low melting point and lead-free composition. This low temperature solder paste is designed to provide efficient and reliable soldering, particularly for applications that involve heat-sensitive components.
Tin Bismuth Solder Paste Sn42Bi58 is meticulously crafted by combining carefully selected solder alloy particles, flux, and binders. The alloy's composition, primarily comprising tin and bismuth, delivers a soldering solution with a significantly lower melting point compared to conventional solder materials. |
Alloy Composition | 42% Tin (Sn), 58% Bismuth (Bi) |
Melting Point | 138°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce this solder paste in syringe | |
Syringe of Solder Paste |
Jar of Solder Paste |
Low Melting Point It has remarkably low melting point, making it ideal for soldering components prone to heat damage, reducing the risk of component failure. | Excellent Soldering Effect This low temperature solder paste can produce round, bright and firm solder joints, this provides long life span to the electronic products. | |
Reasonable Cost Comparing to other lead free solder paste, this solder paste doesn't contain silver, the price is much cheaper. | Lead Free Compliance This solder paste Sn42Bi58 is not consisted of lead, making it suitable for manufacturing that requires RoHS lead free compliant. |
Electronics and devices with Heat-Sensitive Components: Sn42Bi58 solder paste is a staple in electronics manufacturing, particularly for devices with components vulnerable to high temperatures.
Solder Paste Jet Printing |
Solder Paste Manual Printing |
Solder Paste Hand Soldering |
Printing: Use stencil to lay on the PCB and make sure that the opening holes of the stencil precisely sit on the solder pads. And print the low temperature solder paste onto the PCB.
Installing SMD Components: Carefully put surface mount components onto the solder paste-covered pads.
Soldering: Use reflow ovens or hot hair guns to heat the assembled PCB to melt the solder paste to solidify the solder joints.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the tin bismuth solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
注: 建议图片大小150px*50px 
