Views: 0 Author: Site Editor Publish Time: 2024-10-17 Origin: Site
The T3 T4 Tin-Lead Alloy SMD Soldering Paste 63/37 Sn63 Pb37 is a high-performance soldering solution specifically engineered for Surface-Mount Device (SMD) applications. This paste offers a precise alloy composition of 63% tin (Sn) and 37% lead (Pb), which is renowned for its eutectic nature, ensuring a sharp melting point at 183°C. The T3 and T4 grade formulations feature fine particle sizes, enabling exceptional performance in various reflow soldering processes and ensuring smooth application through automated dispensing or stencil printing.
Eutectic Alloy Composition (63/37 Sn/Pb): The Sn63 Pb37 formulation provides a low melting point and eliminates the phase change during cooling, resulting in strong and reliable solder joints without thermal stress.
Consistent Viscosity and Thixotropy: Formulated with high-quality flux, the SMD soldering paste maintains optimal viscosity, preventing slumping and ensuring excellent wetting on a wide range of metal surfaces, including copper, nickel, and gold-plated components.
T3 and T4 Particle Sizes: The T3 and T4 classifications refer to the fine powder granularity in the paste. These sizes allow precise application, ensuring consistent solder deposition and minimizing solder balling during the reflow process. T3 SMD soldering paste 63/37 is for general purpose; T4 SMD soldering paste Sn63 Pb37 is for high precision electronics assembly.
500g Packaging: Available in a convenient 500g bottle, the SMD soldering paste is ideal for medium to large production batches, offering easy handling and storage for long-term use without degradation.
The T3 T4 Sn63 Pb37 Soldering Paste is well-suited for a wide range of SMD soldering applications, including:
Automated PCB Assembly: Designed for use with stencil printers and automatic dispensers, the SMD soldering paste 63/37 ensures accurate and repeatable application, making it a popular choice for high-precision PCB assembly lines.
Fine-Pitch Soldering: With its fine T3 and T4 powder sizes, the SMD soldering paste Sn63 Pb37 is ideal for fine-pitch components and high-density circuit boards, offering consistent flow and precise solder joints.
Prototype and Small-Batch Production: The controlled flow characteristics make this soldering paste suitable for small-scale production and prototype development, where reliability and ease of application are crucial.
Reliable Soldering Performance: The Sn63 Pb37 alloy is favored in the electronics industry for its ease of use and the robust mechanical and electrical connections it forms, which are critical for maintaining circuit integrity.
Excellent Wetting and Solderability: The SMD soldering paste 63/37 delivers consistent wetting action, ensuring high-quality joints and minimizing defects such as voids or bridging between components.
Safety and Handling: As a lead-containing product, it is essential to handle the paste with proper safety measures, including using in a well-ventilated area and following appropriate waste disposal regulations to comply with environmental standards.
Alloy Composition: Sn63 Pb37 (63% Tin, 37% Lead)
Melting Point: 183°C (361.4°F)
Viscosity: Optimized for stability and precision during application
Particle Size: T3 and T4 options for diverse application needs
Packaging: 500g/bottle, designed for extended shelf life under proper storage conditions
This Sn63 Pb37 SMD Soldering Paste is an ideal choice for electronics manufacturers and technicians seeking a time-tested solution for SMD soldering. Its balanced alloy composition, coupled with fine particle sizes, ensures reliability and ease of use in demanding production environments. Whether you are working on complex, high-density boards or developing prototypes, this paste provides the precision and consistency needed for top-quality results.
If you are looking for a supplier or manufacturer T3 T4 Tin-Lead Alloy SMD Soldering Paste 63/37 Sn63 Pb37 - 500g/Bottle from China, please contact our sales team.
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