Views: 0 Author: Site Editor Publish Time: 2024-05-11 Origin: Site
In modern electronics manufacturing, high-quality soldering is key to ensuring reliable connections between circuit boards and chip components. Rosin PPD SMD Solder Paste 63/37 is a soldering material specially designed for integrated circuit (IC) assembly. This article will introduce in detail the characteristics, advantages and application of this product in IC assembly. And our soldering paste 63/37 is packed in 500g/jar, and every 20 jars packed into a foam box and with an outer carton.
SMD Soldering Paste 63/37 is a solder alloy containing 63% tin and 37% lead. Its special formula makes it excellent in IC assembly. This IC soldering paste uses resin core technology and contains active resin ingredients that help improve soldering quality and reduce oxidation during soldering.
High Viscosity: PPD Soldering Paste 63/37 has a moderate viscosity that effectively holds components in place during soldering and prevents them from moving or shifting during soldering.
Good wettability: The rosin soldering paste can quickly wet the soldering surface and form a uniform soldering contact surface to ensure the reliability and stability of the soldering.
Low Residue: After soldering is completed, SMD Soldering Paste 63/37 leaves less residue and is easy to clean, helping to improve the reliability of the circuit board.
Low voids: This SMD soldering paste produces fewer bubbles during the welding process, helping to reduce welding defects and improve the quality of welded joints.
Excellent conductivity: After welding is completed, the solder joint formed by this soldering paste 63/37 has good conductivity, ensuring unobstructed signal transmission on the circuit board.
Antioxidation: PPD soldering paste 63/37 contains active ingredients, which can effectively resist oxidation and ensure the stability and durability of the welded joint.
High efficiency: IC soldering paste 63/37 provides efficient soldering performance during the IC assembly process, which can quickly complete the soldering task and improve production efficiency.
Stability: The SMD soldering paste has high stability, is not easily affected by the external environment, and can maintain consistent welding quality under various working conditions.
Easy to handle: Due to its good flow and wetting properties, PPD Soldering Paste 63/37 is easy to handle, even for novice soldering workers.
Versatility: In addition to being used in IC assembly, this rosin soldering paste 63/37 is also suitable for soldering other micro electronic components, such as capacitors, resistors, etc.
Cost-effectiveness: Compared with other high-end soldering materials, SMD solder paste 63/37 is more economical and suitable for mass production and personal electronics production.
PPD SMD solder paste 63/37 has a wide range of applications in IC assembly:
Surface Mount Technology (SMT): Used to attach microchip components to the PCB surface to achieve high-density circuit layout.
Flip chip assembly (FC): used to connect exposed chips to PCB to reduce the size and weight of the circuit board.
Ball Grid Array Welding (BGA): Used to weld BGA chips to ensure reliable electrical connection between the chip and PCB.
Diode and transistor assembly: used to weld various micro diodes and transistors to achieve functional assembly of electronic devices.
Conclusion
As a high-quality, high-efficiency soldering material,Rosin PPD SMD Soldering Paste 63/37 for provides a reliable solution for IC assembly. Its excellent characteristics and stable performance make it an indispensable part of the electronics manufacturing industry, providing manufacturers and individual electronics production enthusiasts with reliable soldering tools, and promoting the development and innovation of electronic technology.
If you are looking for a China manufacturer of PPD SMD Rosin Soldering Paste 63/37 for IC Assembly, please contact us. Our WhatsApp/Wechat: 008613450770997 or Email: xfsolder@gmail.com or xfsolder@163.com
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