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Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead) for PCB Assembly From China

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Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead) for PCB Assembly From China

Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead) for PCB Assembly from China

In the world of printed circuit board (PCB) assembly, selecting the right type of solder wire is crucial to achieving reliable connections between electronic components and the board. One of the most popular choices is Rosin Activated (RA) Solder Wire 63/37, with a wire diameter of 0.8mm. This type of solder is commonly used by professionals and hobbyists alike, known for its excellent performance, ease of use, and reliability.

Rosin Activated Solder 63/37 0.8mm 

Let's break down what makes this solder wire special and why it is widely used in PCB assembly.

 

What is Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead)?

The numbers 63/37 refer to the composition of the solder wire, which is made up of 63% tin (Sn) and 37% lead (Pb). This particular alloy is classified as eutectic rosin activated solder, which means it has a single, consistent melting point of 183°C (361°F). Unlike non-eutectic solders that go through a mushy phase between solid and liquid, solder wire 63/37 0.8mm transitions directly from solid to liquid and vice versa, which simplifies the soldering process. And rosin activated flux is built into this solder wire for easier soldering operation.

 

Benefits of Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead) for PCB Assembly:

Fast solidification: As soon as the solder wire 63/37 0.8mm cools down, it solidifies rapidly, reducing the chances of forming cold solder joints (weak connections caused by premature movement).

Low melting point: The low melting point 183℃ minimizes the risk of thermal damage to heat-sensitive components.

Consistent performance: The eutectic nature ensures uniform melting and solidification, leading to high-quality joints.

 

What is Rosin Activated (RA) Flux Solder?

Flux is a critical component of solder wire, responsible for cleaning the surfaces to be joined, ensuring that oxidation doesn't interfere with the soldering process. In the case of Rosin Activated (RA) solder, the flux is derived from natural rosin, a substance obtained from pine trees, and it has been chemically activated to increase its cleaning power.

 

Why Use Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead)?

Strong cleaning action: RA flux is designed to remove oxides from the surfaces of the metal, ensuring that the solder bonds effectively to the components.

Reliable joints: By eliminating contamination, the RA flux of rosin activated solder 63/37 helps create strong, conductive solder joints.

Widely compatible: It works well with most electronic components, particularly when assembling PCBs.

 

Why Choose 0.8mm Diameter of Solder Wire 63/37 for PCB Assembly?

The 0.8mm diameter of the solder wire (63% tin, 37% lead) is an ideal size for general-purpose PCB soldering. It strikes a good balance between precision and usability, making it suitable for soldering small components and pads commonly found on PCBs. This size allows for good control of the amount of solder applied without overwhelming the connection points with excess material.

 

Applications of Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead):

Surface-mount devices (SMD): The small diameter 0.8mm of solder wire 63/37 is perfect for fine-pitch SMDs, where space is limited.

Through-hole components: It provides sufficient flow for through-hole soldering without excess solder buildup.

General repair work: This rosin activated solder is ideal for reworking and repairing electronics, offering precision without clogging up small spaces.

 

Key Advantages of Rosin Activated Solder Wire 63/37 0.8mm (63% Tin, 37% Lead) in PCB Assembly:

Precision Soldering: The small 0.8mm diameter provides better control during the soldering process, which is essential when working with small PCB pads and tiny components.

High Reliability: The composition of solder wire 63% tin and 37% lead ensures strong, reliable joints with consistent melting and solidification behavior, which is crucial for electronics that need to withstand daily use.

Good Flow Characteristics: The eutectic property and rosin activated flux ensure that the solder flows smoothly and adheres well to surfaces, reducing the likelihood of cold or brittle joints.

User-Friendly: Due to its low melting point and ease of use, this solder wire is favored by both beginners and seasoned professionals in electronics.

solder wire 63% tin and 37% lead 

How to Use Rosin Activated Solder Wire 63/37 0.8mm (63% Tin and 37% Lead) for PCB Assembly

Prepare the Surface: Ensure that the PCB and component leads are clean. This helps the flux in the solder wire to work effectively.

Heat the Joint: Use a soldering iron with an appropriate tip size (usually small or medium for PCB work). Heat the joint and the component lead.

Apply the Solder: Once the joint is hot enough, bring the 0.8mm solder wire 63% tin 37% lead to the joint, allowing it to melt and flow into the connection.

Inspect the Joint: After soldering, inspect the joint to ensure it has a shiny, smooth surface without cold joints or bridging (where solder connects unintended points).

Clean the Residue: After soldering, it is recommended to clean the PCB to remove any leftover flux residue.

 

Conclusion

Rosin Activated Solder Wire 63/37 (0.8mm) is an excellent choice for PCB assembly due to its eutectic properties, active flux for reliable cleaning, and the precise control it offers for small, intricate soldering jobs. Whether you are assembling new PCBs or performing repair work, this type of solder wire ensures high-quality, durable connections that stand the test of time.

 

Contact our sales team regarding our solder wire 63/37:

Email: xfsolder@gmail.com or xfsolder@163.com

WhatsApp/Wechat: 008613450770997

 

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