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Lead-Free Tin Paste Sn99Ag0.3Cu0.7 SAC0307 T3 And T4 Powder Size from China

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Lead-Free Tin Paste Sn99Ag0.3Cu0.7 SAC0307 T3 And T4 Powder Size from China

Lead-Free Tin Paste Sn99Ag0.3Cu0.7 SAC0307 T3 and T4 Powder Size

In today's electronics manufacturing industry, choosing the right tin solder paste is crucial to ensuring high-quality production. As the demand for environmentally friendly and efficient materials continues to rise, we are proud to introduce our Lead-Free Tin Paste Sn99Ag0.3Cu0.7 SAC0307, available in T3 and T4 powder sizes. Tin paste is a pasty product that is a mixture of flux greese with tin powder. This tin paste is specially formulated to meet the needs of modern electronics manufacturing, offering excellent performance and reliability.

 

Why Choose Sn99Ag0.3Cu0.7 SAC0307 Lead-Free Tin Paste?

Environmentally Friendly: This lead-free tin paste is RoHS compliant, making it an ideal choice for manufacturers looking to reduce their environmental footprint while still meeting strict regulations. With its lead-free formulation, it is safer for workers and the environment, without compromising on performance.

 

Optimized Alloy Composition: The SAC0307 alloy composition of 99% Tin (Sn), 0.3% Silver (Ag), and 0.7% Copper (Cu) ensures strong mechanical properties and excellent solderability. This composition Sn99Ag0.3Cu0.7 tin paste minimizes voids during soldering, providing a stable and reliable connection in electronic assemblies.

 

Versatile Powder Sizes: This tin paste Sn99Ag0.3Cu0.7 is available in T3 and T4 powder sizes, this product offers flexibility to meet different application needs:

 

T3 Powder: This powder size is 25-45microns. This lead free tin paste T3 is ideal for standard PCB assembly processes, offering smooth and consistent printing. It provides a balanced flow and ensures strong adhesion to pads, making it perfect for most applications.

T4 Powder: This powder size is 20-38microns. With finer particles, lead free tin paste T4 powder size is well-suited for more intricate and high-density electronic assemblies. It delivers a more precise print, which is particularly beneficial for smaller components and complex circuit boards.

Lead-Free Tin Paste T3 T4 

Key Features of Sn99Ag0.3Cu0.7 SAC0307 Lead-Free Tin Paste T3 and T4 Powder

Excellent Wetting Properties: The solder tin paste SAC0307 ensures a strong, uniform joint, thanks to its superior wetting characteristics. This helps in minimizing defects such as tombstoning and bridging, improving the overall quality of the solder joints.

Stable Viscosity: The lead free tin paste Sn99A0.3Cu0.7 is designed to maintain a consistent viscosity over time, ensuring smooth and repeatable printing results, even in high-volume production environments.

Low Residue and Clean Finish: After reflow, the tin paste T3 and T4 leaves behind minimal residue, resulting in a clean and aesthetically pleasing finish. This makes it easier for post-production inspections and reduces the need for additional cleaning processes.

Wide Reflow Window: The SAC0307 tin paste offers a broad reflow temperature range, providing more flexibility during the soldering process and reducing the risk of thermal damage to sensitive components.

 

Applications of Sn99Ag0.3Cu0.7 SAC0307 Lead-Free Tin Paste T3 and T4:

This tin paste is ideal for use in a variety of SMT applications, including: 

Consumer electronics (smartphones, tablets, and laptops)

Automotive electronics (ECUs, sensors, and infotainment systems)

Industrial electronics (control systems, robotics, and automation)

Telecommunication devices (routers, modems, and network equipment)

lead free tin paste for SMT 

Conclusion

Choosing the right tin solder paste can make a significant difference in the quality and reliability of your products. Our Lead-Free Tin Paste Sn99Ag0.3Cu0.7 SAC0307 T3, available in T3 and T4 powder sizes, combines high performance with environmental responsibility, making it the perfect choice for electronics manufacturers. Whether you are producing high-density boards or standard PCBs, this paste will deliver the consistency and quality your production line demands.

 

For more information or to place an order, contact us today and experience the next level of lead-free soldering solutions!

 

If you are looking for a supplier or manufacturer of Lead-Free Tin Paste Sn99Ag0.3Cu0.7 SAC0307 T3 and T4 Powder Size from China, please contact our sales team.

 

Contact information:

Email: xfsolder@gmail.com or xfsolder@163.com

WhatsApp/Wechat: 008613450770997

 


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