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Lead-Free Solder Wire Sn96.5/Ag3.0/Cu0.5 (96.5% Tin, 3.0% Silver, 0.5% Copper) from China

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Lead-Free Solder Wire Sn96.5/Ag3.0/Cu0.5 (96.5% Tin, 3.0% Silver, 0.5% Copper) from China

Lead-Free Solder Wire Sn96.5/Ag3.0/Cu0.5 (96.5% Tin, 3.0% Silver, 0.5% Copper) from China

Our lead-free solder wire, composed of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu), commonly referred to as SAC305, is designed for high-quality electronic assembly and repair. This widely trusted alloy meets the RoHS (Restriction of Hazardous Substances) directives, making it an environmentally responsible choice. Its exceptional soldering performance and strong thermal and electrical properties make it ideal for a variety of industrial applications.

 

Specifications of Lead-Free Solder Wire (96.5% Tin, 3.0% Silver, 0.5% Copper)

Alloy Composition: Sn96.5/Ag3.0/Cu0.5 

Melting Temperature: 217–221°C

Flux Core: Available in multiple flux core percentages, typically between 2.0% and 3.0%, for optimal flow and wetting

Wire Diameters: Available in various diameters, including 0.3mm, 0.5mm, 0.8mm, and 1.0mm up to 3mm.

Spool Weights: Offered in weights ranging from 100g to 1kg, providing flexibility for different production requirements

 

The availability of different wire diameters and spool weights allows for adaptability across multiple soldering needs. Thinner diameters, like 0.3mm or 0.5mm, are ideal for precise soldering tasks, especially on fine-pitch components in surface-mount technology (SMT). Medium diameters, such as 0.8mm or 1.0mm, are best for more substantial solder joints and through-hole components. And larger diameters such as 1.6mm 2mm or 3mm, are suitale for welding large components which need bigger amount of solder to combine. Spool weights range from small 100g rolls, suitable for hand-soldering and prototyping, to larger 1kg spools for automated, high-volume manufacturing. This range enables users to select the ideal size for their specific projects, minimizing waste and maximizing efficiency.

wire diameters of solder wire 96.5% tin 3.0% silver 0.5% copper 

Key Features of Specifications of Lead-Free Solder Wire (96.5% Tin, 3.0% Silver, 0.5% Copper)

Excellent Wetting and Flow Characteristics: The Solder wire Sn96.5/Ag3.0/Cu0.5 SAC305 alloy ensures smooth, consistent flow during soldering, producing reliable connections with minimal bridging or voids.

 

Moderate Melting Range: With a melting point between 217–221°C, this solder wire provides consistent thermal performance, reducing stress on temperature-sensitive components and contributing to long-lasting solder joints.

 

High Oxidation Resistance: The solder wire Sn96.5/Ag3.0/Cu0.5 has a strong resistance to oxidation during soldering, enhancing reliability and the longevity of solder joints in varied environments.

 

Exceptional Electrical Conductivity: With its high silver content, solder wire with 3.0% silver offers outstanding conductivity, essential for high-performance electronic applications.

 

Environmentally Safe: As a lead-free solution, solder wire 96.5% tin aligns with RoHS standards, offering a safer and more sustainable alternative for workers and end users alike.

flux core solder wire sn96.5/ag3.0/cu0.5 

Applications of Specifications of Lead-Free Solder Wire (96.5% Tin, 3.0% Silver, 0.5% Copper)

Lead-free solder wire Sn96.5/Ag3.0/Cu0.5 is highly versatile, making it a preferred choice in industries like consumer electronics, automotive, telecommunications, and medical devices. It is well-suited for a range of soldering techniques and applications:

 

Hand-Soldering: The solder wire Sn96.5/Ag3.0/Cu0.5, is ideal for repair work and low-volume production, providing excellent flow and strong bonds for a variety of electronic components.

 

Automated Soldering Processes: The consistent quality and performance make solder wire 3.0% silver suitable for automated soldering in high-volume production environments, ensuring durable connections on both single- and double-sided printed circuit boards (PCBs).

 

Surface-Mount Technology (SMT) and Through-Hole Soldering: The wide range of available diameters supports both SMT fine-pitch soldering and through-hole applications, offering flexibility for different assembly needs.

bright solder joint of lead free solder wire 

Choosing our SAC305 lead-free solder wire guarantees a high-performance, eco-friendly solution tailored for modern electronics manufacturing. With reliable solderability, excellent conductivity, and compliance with environmental regulations, this solder wire supports the highest standards in electronics assembly and ensures lasting, dependable solder joints for diverse applications.

 

If you are looking for a manufacturer of Lead-Free Solder Wire Sn96.5/Ag3.0/Cu0.5 (96.5% Tin, 3.0% Silver, 0.5% Copper) from China, please contact us.

 

Contact Information:

Email: xfsolder@gmail.com or xfsolder@163.com

WhatsApp/Wechat: 008613450770997


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