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Comparison And Application of Tin Solder Paste Sn62.8Pb32.8Ag0.4 And Tin Solder Paste Sn63Pb37 63 37

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Comparison And Application of Tin Solder Paste Sn62.8Pb32.8Ag0.4 And Tin Solder Paste Sn63Pb37 63 37

Comparison and application of tin solder paste Sn62.8Pb32.8Ag0.4 and tin solder paste Sn63Pb37 63 37 

In the electronics manufacturing industry, solder paste is a widely used soldering material used to connect electronic components and printed circuit boards (PCBs). Two common solder paste types are Sn62.8Pb32.8Ag0.4 and Sn63Pb37. The solder paste Sn63Pb37 is also known as solder paste 63 37. They are slightly different in composition and application. The following will compare them and introduce their typical applications and products.

Tin Solder Paste 

Ingredient comparison between tin solder paste Sn62.8Pb32.8Ag0.4 and tin solder paste Sn63Pb37 63 37

Tin paste Sn62.8Pb32.8Ag0.4:

It contains 62.8% tin (Sn), 32.8% lead (Pb) and 0.4% silver (Ag).

Small amounts of silver added help improve the strength and corrosion resistance of solder joints.

 

Tin paste Sn63Pb37:

It contains 63% tin (Sn) and 37% lead (Pb).

It has no other added elements and is a classic tin-lead alloy.

Solder paste Sn62.8Pb36.8Ag0.4Solder paste Sn63Pb37 63 37 

Comparison of physical properties between tin solder paste Sn62.8Pb32.8Ag0.4 and tin solder paste Sn63Pb37 63 37:

Melting point:

The melting point of solder paste Sn62.8Pb32.8Ag0.4 is about 181°C, which is slightly lower than Sn63Pb37.

The melting point of solder paste Sn63Pb37 63 37 is about 183°C, which is slightly higher than Sn62.8Pb32.8Ag0.4.

 

Fluidity comparison:

Due to the addition of silver, solder paste Sn62.8Pb32.8Ag0.4 has better fluidity and wettability, making solder joints easier to form.

 

Applications comparison between tin solder paste Sn62.8Pb32.8Ag0.4 and tin solder paste Sn63Pb37 63 37

Solder paste Sn62.8Pb32.8Ag0.4:

It is suitable for applications requiring high strength and corrosion resistance, such as aerospace, automotive electronics, etc.

Common products: avionics equipment, automotive electronic control systems, medical equipment, etc.

 

Solder paste Sn63Pb37 63 37:

As a traditional welding material, solder paste 63 37 is widely used in general electronic manufacturing fields.

Common products: smartphones, computers, home appliances and other consumer electronics products.

 

Environmental protection and regulations

Both tin paste Sn62.8Pb32.8Ag0.4 and tin paste Sn63Pb37 solder pastes contain lead, and their use may be restricted by some environmental regulations. You need to pay attention to the environmental impact and handling methods. In some regions, especially the European Union and other regions, the use of lead-containing materials may be restricted and must comply with corresponding environmental regulations.

 

In conclusion

Specific application requirements, regulatory restrictions, and environmental considerations need to be taken into consideration when selecting suitable welding materials. Solder paste Sn62.8Pb32.8Ag0.4 has better strength and corrosion resistance due to the addition of silver, and is suitable for fields that require high welding quality; while Solder paste Sn63Pb37 63 37 is a traditional welding material suitable for general electronic manufacturing. field. In any case, make sure to comply with local environmental regulations and select materials suitable for the specific application.


If you need to import tin solder paste Sn62.8Pb32.8Ag0.4 or tin solder paste Sn63Pb37 63 37 directly from a Chinese manufacturer, please contact us. Our WhatsApp/Wechat: 008613450770997 ; Emails: xfsolder@gmail.com or xfsolder@163.com 


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